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Semiconductor Crystals
更新时间: 2021-11-03 09:39:53 访问次数: 0



SOI is to place a thin layer of silicon on an insulating substrate. Devices based on the SOI structure will essentially reduce junction capacitance and leakage current, increase switching speed, reduce power consumption, and achieve high-speed, low-power operation.


Product specification

Dimensions

4inch;6inch;8inch

Process

Smart cut; Bonding; SIMOX 

Type

N/P

Resistance

Custom

Top crystal thickness

      0.22~50μm

Buried oxide layer

0.4~4μm

Base layer thickness

100~500μm

TTV

<3μm

Particle

<10@0.3μm



Comparison of SIMOX, Bonding and Simbond three methods

Items

SIMOX

Bonding

Simbond

Wafers

One wafer

Two wafers

Two wafers

Wafer size

4', 5', 6' & 8'

4', 5', 6' & 8'

4', 5', 6' & 8'

Process

Two basic steps

Three basic steps

Four basic steps

SOI thickness

Thin/ultra-thin

Thick (>1.5um)

Thin/ultra thin/thick

BOX thickness

Thin (<400nm)

Thin/thick

Thin/thick

BOX property

Good/Average

Good

Good

SOI uniformity

Good

Average

Good

SOI application
 

SOI high-speed characteristics Microprocessor, high-speed communication, three-dimensional image processing, advanced multimedia
SOI low voltage and low power consumption characteristicsMobile computers, mobile phones, portable electronic equipment, radio frequency integration, smart power devices and other fields that require low power consumption and fast heat dissipation, such as single-chip system SOC, micro satellites, etc.
SOI used in harsh environmentsHigh-temperature devices, high-voltage devices, satellites or other space applications, weapon control systems, etc.
SOI optical communication and MEMS applicationsAs a structural material, it can be used to make silicon-based integrated optoelectronic devices, which are used in the interface of high-speed broadband Internet and other optical networks. In addition, SOI wafers are also widely used in the production of microelectromechanical system (MEMS) devices, such as sensors, etc.



Advantages of Fast Silver SOI wafers mainly have the following characteristics:

1. Improve running speed
Under a certain voltage, the operating speed of circuits built on Simao SOI materials is 30% higher than that of circuits built on ordinary silicon materials, which greatly improves the performance of microprocessors and other devices.

2. Reduce energy consumption
Fast Silver SOI material can reduce energy consumption by nearly 30%-70%, and is especially suitable for areas where energy consumption is relatively high.

3. Improve running performance
Fast Silver SOI material can withstand high temperatures as high as 350 degrees Celsius or even 500 degrees Celsius, which is especially suitable for equipment that must operate well in harsh environments.

4. Reduce package size
Fast Silver SOI material can meet the requirements of IC manufacturers for smaller and smaller products

Fast Silver offers various semiconductor crystals:SOI material, GaAs, ZnO, SiC, Ge and Si.


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