Coating materials for chips represent one of the highest standards in the coating material industry.
 
High-purity sputtering targets have emerged with the development of the semiconductor industry, and the integrated circuit industry has become one of the main application areas of high-purity sputtering targets. With the rapid development of information technology, the requirements for integrated circuits are getting higher and higher, and the size of the unit devices in the circuit is constantly shrinking, and the size of the components is from millimeter to micrometer, and then to nanometer. Each unit device is composed of a substrate, an insulating layer, a dielectric layer, a conductive layer, and a protective layer. Among them, the dielectric layer, the conductive layer and even the protective layer all use the sputtering coating process, so the sputtering target is a preparation integrated One of the core materials of the circuit. The target materials for coating in the field of integrated circuits mainly include aluminum targets, titanium targets, copper targets, tantalum targets, tungsten titanium targets, etc. The purity of the target materials is required to be very high, generally above 5N (99.999%). Therefore, the target material for semiconductor coating is expensive. Semiconductor targets are mainly used in wafer manufacturing and packaging and testing processes.