Presently, the main methods of preparing target materials are casting and powder metallurgy.

Casting method: melt the alloy raw material with certain composition ratio, then pour the alloy solution into the mold to form the ingot, and finally make the target material through mechanical processing. The casting method melts and casts in vacuum.The commonly used melting methods include vacuum induction melting, vacuum arc melting and vacuum electron bombardment melting.The disadvantage is that for two or more kinds of metals with large difference in melting point and density, it is difficult to obtain the alloy target with uniform composition by ordinary melting method.

Powder metallurgy method: melt the alloy raw materials with certain composition ratio, pour them into ingot and then crush them. The pulverized powder is formed by isostatic pressing and then sintered at high temperature to form the target material.The disadvantages are low density and high impurity content. Common powder metallurgy processes include cold pressing, vacuum hot pressing and hot isostatic pressing.

 
According to different application directions, it can be divided into:

1. Semiconductor related target:

Electrode and wiring film: aluminum target, copper target, gold target, silver target, palladium target, platinum target, al-si alloy target, al-si copper alloy target, etc.

Storage electrode film: molybdenum target, tungsten target, titanium target, etc.

Adhesive film: tungsten target, titanium target, etc.

Capacitor insulation film: lead zirconate titanate target, etc.

2. Magnetic recording target:

Vertical magnetic recording film: cobalt-chromium alloy target, etc.

Film for hard disk: cobalt chromium tantalum target, cobalt chromium platinum target, cobalt chromium tantalum platinum target, etc.

Thin film magnetic head: cobalt tantalum chromium alloy target, cobalt chromium zirconium alloy target, etc.

Intraocular crystal film: cobalt platinum alloy target, cobalt palladium alloy target, etc.

3. Optical recording target:

Phase change optical disc recording films: telluride selenide target, antimony selenide target, germanium antimony telluride alloy target, germanium telluride alloy target, etc.

Magnetic disc recording film: dysprosium iron cobalt alloy target, terbium dysprosium iron alloy target, terbium iron cobalt alloy target, alumina target, magnesium oxide target, silicon nitride target, etc.

Optical disc reflective film: aluminum target, aluminum titanium alloy target, aluminum chromium alloy target, gold target, gold alloy target, etc.

Optical disc protection film: silicon nitride target, silicon oxide target, zinc sulfide target, etc.

4. Display target material:

Transparent conductive film: indium tin oxide target, zinc oxide aluminum target, etc.

Electrode wiring film: molybdenum target, tungsten target, titanium target, tantalum target, chromium target, aluminum target, aluminum titanium alloy target, aluminum tantalum alloy target, etc.

Electroluminescent film: ZnS doped with manganese target, ZnS doped with terbium target, calcium sulfide doped with europium target, yttrium oxide target, tantalum oxide target, barium titanate target, etc

5. Other application targets:

Decorative film: titanium target, zirconium target, chromium target, titanium aluminum alloy target, stainless steel target, etc.

Low resistance film: Ni-Cr alloy target, Ni-Cr silicon alloy target, Ni-Cr aluminum alloy target, ni-cu alloy target, etc.

Superconducting thin films: ybco target material, bismuth strontium calcium copper oxygen target material, etc.

Tool plating film: nitride target, carbide target, boride target, chromium target, titanium target, titanium alloy target, zirconium target, graphite target, etc.