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99.9999% Copper (Cu) Wires for Thin Film CoatingSpecificationsMaterial TypeCopperSymbolCuPurity99.9999%Sizeφ0.5mmPackage Unit500g/ 1kgTheoretical Density (g/cc)8.92Z Ratio0.437Color/AppearanceCopper, MetallicE-BeamExcellentAtomic Weight63.546Thermal Evaporation TechniquesBoat:Mo, WCoil:...

| Specifications | |||
| Material Type | Copper | ||
| Symbol | Cu | ||
| Purity | 99.9999% | ||
| Size | φ0.5mm | ||
| Package Unit | 500g/ 1kg | ||
| Theoretical Density (g/cc) | 8.92 | Z Ratio | 0.437 |
| Color/Appearance | Copper, Metallic | E-Beam | Excellent |
| Atomic Weight | 63.546 | Thermal Evaporation Techniques | Boat: Mo, W Coil: W Basket: W Crucible: Al2O3, Mo, Ta |
| Melting Point (°C) | 1,083 | E-Beam Crucible Liner Material | Graphite, Molybdenum |
| Coefficient of Thermal Expansion | 16.5 x 10-6/K | Temp. (°C) for Given Vap. Press. (Torr) | 10-8: 727 10-6: 857 10-4: 1,017 |
| Thermal Conductivity | 400 W/m.K | Comments | Adhesion poor. Use interlayer (Cr). Evaporates using any source material. |
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