Hotline
+86 13310681862
Copper sputter targets are used for CD-ROM, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc. Sputtering is a process whereby atoms are ejected from a solid target material due to the bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
For questions about target material or anything we can hlep, please click here.
| Specifications | |||
| Material Type | Copper | ||
| Symbol | Cu | ||
| Purity | 99.99%~99.9999% | ||
| Size | 1.00" Dia. x 0.125" Thick ~8.00" Dia x 0.250" Thick / Custom | ||
| Package Unit | 1pc | ||
| Atomic Weight | 63.546 | Z Ratio | 0.437 |
| Color/Appearance | Copper, Metallic | Sputter | DC |
| Thermal Conductivity | Copper, Metallic | Max Power Density(Watts/Square Inch) | 200* |
| Melting Point (°C) | 1,083 | Type of Bond | Indium, Elastomer |
| Coefficient of Thermal Expansion | 16.5 x 10-6/K | Max Power Density(Watts/Square Inch) | 100* |
| Theoretical Density (g/cc) | 8.92 | Comments | Adhesion poor. Use interlayer (Cr). Evaporates using any source material |
