Copper Sulfide (CuS) Sputtering Target

Performance Characteristics:

Physical Properties:

Copper sulfide targets exhibit relatively high density, ensuring stable sputtering rates and uniform thin-film deposition. 

Their balanced hardness provides sufficient resistance to ion bombardment during sputtering while remaining suitable for machining and shaping.

Chemical Properties:

The material demonstrates good chemical stability under standard conditions. However, exposure to high temperatures, 

high humidity, or other extreme environments may lead to chemical reactions, such as oxidation. Proper storage and environmental 

control during handling and use are essential.

Electrical Properties:

Copper sulfide possesses inherent electrical conductivity. This property is crucial for efficient charge transfer during magnetron 

sputtering processes and directly influences the electrical characteristics of the deposited films.

Application Fields:

Semiconductor Manufacturing:

Used to deposit conductive layers or diffusion barrier layers in integrated circuits, enhancing device performance and reliability.

Solar Cells:

Employed for fabricating electrodes or absorber layers, contributing to improved photoelectric conversion efficiency.

Optical Coatings:

Utilized to deposit functional thin films (e.g., reflective coatings, filter layers) for enhanced optical device performance.

Other Fields:

Applications include lithium-ion battery cathode materials, catalysts, and biomedical applications.

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