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Boron Nitride (BN) Sputtering Target

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Boron Nitride (BN) Sputtering TargetApplications of Boron Nitride (BN) Sputtering TargetsBoron nitride (BN) sputtering targets are indispensable in advanced thin-film research and industrial applications due to their unique combination ofthermal, electrical, and mechanical properties. Below ar...

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Boron Nitride (BN) Sputtering Target


Applications of Boron Nitride (BN) Sputtering Targets


Boron nitride (BN) sputtering targets are indispensable in advanced thin-film research and industrial applications due to their unique combination of 

thermal, electrical, and mechanical properties. Below are key application domains supported by academic and industrial advancements:


1. Semiconductor & Microelectronics

2D Heterostructures:

h-BN as Atomically Smooth Insulators: Utilized as dielectric spacers in graphene/h-BN heterostructures, enabling ultrahigh electron mobility 

(>10,000 cm²/V·s) and low interface defects (RMS roughness <0.3 nm). Critical for quantum Hall effect studies and high-frequency transistors.

c-BN for Wide-Bandgap Electronics: Cubic BN’s high thermal conductivity (13 W/m·K) and extreme hardness (>40 GPa) make it ideal for high-power 

electronic devices operating at >500°C.

Deep-Ultraviolet (DUV) Photonics:

h-BN’s wide bandgap (~6 eV) enables DUV photodetectors with cutoff wavelengths <200 nm, essential for solar-blind UV sensing

and lithography alignment systems.


2. Advanced Optics & Coatings

UV-Transparent Films:

h-BN coatings for DUV optics (190–300 nm range) exhibit <5% absorption, outperforming conventional MgF₂ in high-radiation environments 

(e.g., synchrotron beamlines).

Thermal Management:

h-BN thin films as thermal interface materials (TIMs) in microelectronics, achieving thermal conductivity >250 W/m·K in-plane for efficient heat 

dissipation in GaN-based power devices.


3. Energy & Nuclear Technologies

Neutron Detection:

Enriched <sup>10</sup>BN targets (neutron capture cross-section: 3,840 barns) are used in solid-state neutron detectors for nuclear reactor monitoring 

and non-proliferation applications.

Thermoelectric Systems:

h-BN/c-BN nanocomposites enhance thermoelectric efficiency via phonon scattering engineering, achieving ZT values >0.8 in boron-rich alloys.


4. Quantum Technologies

Single-Photon Emitters:

h-BN hosts room-temperature quantum emitters with narrow linewidths (<1 nm), enabling quantum sensing and secure communication systems.

Spintronic Interfaces:

Ultrathin h-BN layers (<5 nm) serve as tunnel barriers in magnetic tunnel junctions (MTJs), achieving tunneling magnetoresistance (TMR) ratios >300%.


5. Mechanical & Tribological Coatings

Wear-Resistant Coatings:

c-BN coatings on cutting tools (e.g., end mills) extend tool life by >300% in machining hardened steels (HRC >60) due to hardness rivaling diamond (50 GPa).

High-Temperature Lubricants:

h-BN lubricating films reduce friction coefficients to <0.02 in aerospace bearings operating at 800°C in inert atmospheres.


6. Research Frontiers

Neuromorphic Computing:

Amorphous BN (a-BN) memristors demonstrate stable resistive switching (10<sup>6</sup> cycles) for brain-inspired computing architectures.

Plasmonic Metamaterials: h-BN hyperbolic phonon polaritons enable sub-diffraction-limited imaging in mid-IR spectroscopy.


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BN sputtering target

Specifications
Material TypeBoron Nitride
SymbolBN
Purity99.9%
Size1.00" Dia. x 0.125" Thick ~8.00" Dia x  0.250" Thick / Custom
Package Unit1pc
Theoretical Density (g/cc)2.25Z Ratio0.464
Color/AppearanceWhite, Crystalline SolidSputterRF, RF-R
CommentsDecomposes over 750°C.Type of BondIndium, Elastomer
Melting Point (°C)~3,000Max Power Density
(Watts/Square Inch)
20*
Coefficient of Thermal Expansion11 x 10-6/KCommentsDecomposes when sputtered. Reactive preferred


 


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