Iron Oxide (Fe3O4) Sputtering Target

(Fe3O4), which has interesting characteristics including a high degree of spin polarisation and a half-metallic nature with a curie temperature of 860 K. 

These properties make the material suitable for a wide range of applications, such as photo-magnetics, high-density digital recording, ferrofluids, 

catalysis, biomedicine, ultra-high frequency devices and tunnel magnetic resistance.

In the field of advanced materials, iron oxide (Fe₃O₄) sputtering targets are emerging as a "strategic asset" for military, aerospace, and electronics industries, 

leveraging their unique magnetic and infrared properties. How does it achieve infrared stealth? What breakthroughs can it bring to modern technology? 

I. Advantages of Fe₃O₄ Sputtering Targets

Excellent Magnetic Properties

Fe₃O₄ is a typical ferrite, exhibiting high saturation magnetization and low coercivity, classifying it as a soft magnetic material.

It displays ferrimagnetism at room temperature, and its magnetic properties can be tuned through doping or processing adjustments.

Unique Electrical Conductivity

Possessing an inverse spinel structure, electrons can hop between Fe²⁺ and Fe³⁺ ions, resulting in significant conductivity (semimetallic behavior) 

and a resistivity lower than typical oxides.

Chemical Stability

Stable under ambient conditions, but may oxidize (e.g., transforming to Fe₂O₃) or dissolve under high temperatures or in acidic environments.

High Density and Homogeneity

Targets are typically fabricated via sintering processes, requiring high density (≥95% theoretical density) and compositional uniformity to ensure 

the quality of deposited thin films.

Optical Properties

In thin film form, it exhibits strong infrared absorption characteristics, making it suitable for optical coatings.

II. Applications of Fe₃O₄ Sputtering Targets

Magnetic Storage and Spintronics

Magnetic Recording Media: Used to fabricate high-density magnetic storage films (e.g., for hard disk drives).

Spin Valve Devices: Serves as a component in Magnetic Tunnel Junctions (MTJs) for applications like Magnetic Random-Access Memory (MRAM).

Biomedical Field

Magnetic Nanoparticles: Fe₃O₄ nanoparticles produced via sputtering or Pulsed Laser Deposition (PLD) are used for targeted drug delivery, 

magnetic hyperthermia, or as MRI contrast agents.

Biosensors: Utilizes magnetic response properties for biomolecule detection.

Electromagnetic Shielding and Wave-Absorbing Materials

Used to prepare thin films or coatings that absorb electromagnetic waves in specific frequency bands (e.g., microwave absorption), 

applicable in stealth technology or electronic device shielding.

Catalysis and Energy

Photocatalysis: Fe₃O₄ films can act as catalyst supports or directly participate in photocatalytic reactions (e.g., pollutant degradation).

Lithium-Ion Batteries: Employed as electrode coatings to enhance conductivity and cycling stability.

Functional Coatings

Used to create wear-resistant, corrosion-resistant, or magnetic functional coatings (e.g., for magnetic sensors, electronic component encapsulation).

Scientific Research

Studying transport properties of magnetic materials, multiferroic behavior, or interface effects (e.g., coupling with topological insulators).

III. Fabrication and Key Process Considerations

Target Fabrication: Typically involves powder metallurgy methods (e.g., hot pressing, spark plasma sintering), requiring controlled oxygen 

partial pressure to prevent phase transformations.

Deposition Techniques: Commonly used methods include magnetron sputtering (reactive sputtering or direct use of Fe₃O₄ targets) and 

Pulsed Laser Deposition (PLD).

Doping Modification: Magnetic properties and conductivity can be adjusted by incorporating elements like Zn or Co.

With the emergence of technologies like 6G communication and intelligent stealth equipment, demand for Fe₃O₄ sputtering targets is projected to 

grow at an annual rate exceeding 15%. From "invisible" stealth technology to "tangible" electronic devices, Fe₃O₄ sputtering targets are reshaping 

the boundaries of future materials.