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High-Purity Platinum (Pt) Sputtering TargetsHigh-purity platinum (Pt) sputtering targets are indispensable in advanced thin-film deposition technologies, leveraging platinum’s exceptional chemical stability, high melting point (1772°C), superior electrical conductivity, and resistance to corrosion...
High-purity platinum (Pt) sputtering targets are indispensable in advanced thin-film deposition technologies, leveraging platinum’s
exceptional chemical stability, high melting point (1772°C), superior electrical conductivity, and resistance to corrosion.
Applications:
1. Optical and Functional Thin Films
Platinum’s high reflectivity and transparency in UV to IR spectra make it ideal for:
Anti-reflective (AR) and conductive coatings for solar cells and photovoltaic devices, enhancing light absorption and charge transport.
Transparent electrodes in liquid crystal displays (LCDs) and touchscreens, improving contrast and color accuracy.
Protective overcoats for laser optics and precision optical components, ensuring durability in harsh environments.
2. Electronics and Semiconductor Manufacturing
Platinum’s high electrical conductivity and thermal stability enable critical roles in:
High-temperature superconductors and power electronic devices, where Pt films serve as stable interconnects or substrates.
Microelectromechanical systems (MEMS) and sensors, utilizing Pt’s reliability in extreme conditions.
Gate electrodes and resistors in integrated circuits, meeting stringent precision requirements for modern electronics.
3. Energy Conversion and Storage
Pt targets are pivotal in advancing sustainable energy technologies:
Fuel cells: Pt-based thin films act as catalytic layers in proton exchange membrane fuel cells (PEMFCs), optimizing oxygen reduction reaction
(ORR) efficiency while reducing Pt loading through nanostructured designs.
Solar energy: Pt electrodes enhance charge collection in perovskite and dye-sensitized solar cells, improving photoconversion efficiency.
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Specifications | |||
Material Type | Platinum | ||
Symbol | Pt | ||
Purity | 99.95% | ||
Size | 1.00" Dia. x 0.125" Thick ~8.00" Dia x 0.250" Thick / Custom | ||
Package Unit | 1pc | ||
Atomic Weight | 195.084 | Z Ratio | 0.245 |
Color/Appearance | Metallic Gray | Sputter | DC |
Thermal Conductivity | 72 W/m.K | Max Power Density(Watts/Square Inch) | 100* |
Melting Point (°C) | 1,772 | Type of Bond | Indium, Elastomer |
Coefficient of Thermal Expansion | 8.8 x 10-6/K | Max Power Density(Watts/Square Inch) | 100* |
Theoretical Density (g/cc) | 21.45 | Comments | Alloys with metals. Films soft, poor adhesion. Temperatures required to achieve deposition may not be practical for thermal evaporation. |
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