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Aluminum Silicon Copper (AlSiCu) Sputtering Target
These alloys are adapted for various uses. They may be hot rolled, extruded, and cold rolled. They may be made into wire, rods, tubes, sheets and various shapes. They may alsobe drawn, stamped, formed or spun into cups and other forms of drawn metal articles. In short they may be made into various articles by rot rolling, cold rolling, extruding, drawing, or spinning, or any combination of these various operations. Aluminum Silicon Copper sputtering target is used for thin film deposition, especially in conductor contacts in microcircuits.
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| Specifications | |||
| Material Type | Aluminum Silicon Copper | ||
| Symbol | AlSiCu | ||
| Purity | 99.99% | ||
| Size | 1.00" Dia. x 0.125" Thick ~8.00" Dia x 0.250" Thick / Custom | ||
| Package Unit | 1pc | ||
| Element Ratio | Al/Si/Cu=60/20/20 wt% Custom | ||
