Sputtering Targets

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Silicon Nitride (Si3N4) Sputtering Target

Description:

Si3N4 Sputtering Targetsare used for thin film deposition, in particular, provides excellent insulating properties and deposits faster than silicon dioxide. It acts as a possible and as a barrier to sodium diffusion mediumFor questions about target material or anything we can hlep, please clic...

Detail

Si3N4 Sputtering Targets are used for thin film deposition, in particular, provides excellent insulating properties and deposits faster than silicon dioxide. It acts as a possible and as a barrier to sodium diffusion medium

For questions about target material or anything we can hlep, please click here.

Si3N4 sputtering target

Specifications
Material TypeSilicon Nitride
SymbolSi3N4
Purity99.9%
Size1.00" Dia. x 0.125" Thick ~8.00" Dia x  0.250" Thick / Custom
Package Unit1pc
Theoretical Density (g/cc)3.44
Melting Point (°C)1,900SputterRF, RF-R
Type of BondIndium, ElastomerMax Power Density
(Watts/Square Inch)
20*


 


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