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Boron sputtering targets are used for thin film deposition, typically for fuel cell, decoration, semiconductor, display, LED and photovoltaic devices, glass coating, etc. Elemental boron occupies an important position in nuclear reactors because of its neutron absorbing ability. Boron steel is used as the control rod material. Boron compounds can be used in a variety of applications, including the manufacture of certain grades of glass and cleaners.
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| Specifications | |||
| Material Type | Boron | ||
| Symbol | B | ||
| Purity | 99.9% | ||
| Size | 1.00" Dia. x 0.125" Thick ~8.00" Dia x 0.250" Thick / Custom | ||
| Package Unit | 1pc | ||
| Atomic Weight | 10.811 | Z Ratio | 0.389 |
| Color/Appearance | Black, Semi-metallic | Sputter | RF |
| Thermal Conductivity | 27 W/m.K | Max Power Density(Watts/Square Inch) | 20* |
| Melting Point (°C) | 2,079 | Type of Bond | Indium, Elastomer |
| Coefficient of Thermal Expansion | 6 x 10-6/K | Comments | Explodes with rapid cooling. Forms carbide with contain |
