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Aluminum has good thermal properties and is malleable and ductile. Aluminum and its alloys are widely used for various applications including aircraft assemblies and engine parts. Aluminunm sputtering target is used for thin film deposition, typically for conductive film in IC's, high reflectivity front surface mirrors and reflectors on glass, oxidized form and interference filters, etc.
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| Specifications | |||
| Material Type | Aluminum | ||
| Symbol | Al | ||
| Purity | 99.999%~99.9999% | ||
| Size | 1.00" Dia. x 0.125" Thick ~8.00" Dia x 0.250" Thick / Custom | ||
| Package Unit | 1pc | ||
| Atomic Weight | 26.9815386 | Z Ratio | 1.08 |
| Color/Appearance | Silvery, Metallic | Sputter | DC |
| Thermal Conductivity | 235 W/m.K | Max Power Density(Watts/Square Inch) | 150* |
| Melting Point (°C) | 660 | Type of Bond | Indium, Elastomer |
| Coefficient of Thermal Expansion | 23.1 x 10-6/K | Max Power Density(Watts/Square Inch) | 100* |
| Theoretical Density (g/cc) | 2.7 | Comments | Alloys W/Mo/Ta. Flash evap or use BN crucible. |
