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Boron sputtering targets
Boron has an energy band gap of 1.50 to 1.56 eV.Boron-based layer yields the outstanding properties of high hardness, good wear and corrosion resistance.
Boron sputtering targets are used for thin film deposition, typically for fuel cell, decoration, semiconductor, display, LED and photovoltaic devices, glass coating, etc.
| Specifications | |||
| Material Type | Boron | ||
| Symbol | B | ||
| Purity | 99.9% | ||
| Size | 1.00" Dia. x 0.125" Thick ~8.00" Dia x 0.250" Thick / Custom | ||
| Package Unit | 1pc | ||
| Atomic Weight | 10.811 | Z Ratio | 0.389 |
| Color/Appearance | Black, Semi-metallic | Sputter | RF |
| Thermal Conductivity | 27 W/m.K | Max Power Density(Watts/Square Inch) | 20* |
| Melting Point (°C) | 2,079 | Type of Bond | Indium, Elastomer |
| Coefficient of Thermal Expansion | 6 x 10-6/K | Comments | Explodes with rapid cooling. Forms carbide with contain |
